TPS50601-SP: 5962R1022101VSC

RUBY ALUSH

Prodigy 75 points

Part Number: TPS50601-SP

Tool/software:

Hello

What is the gold plating thickness on terminals and device's underbelly?

Are there any instruction regarding performing degolding on device's underbelly?

Thank you

@ohad_bonneh@ti.com

@roy_rehavi@ti.com

2 months ago

0 Sarah Koch 2 months ago

TI__Genius 12010 points

Hi Ruby,

This is documented in Hermetic Package Reflow Profiles, Termination Finishes, and Lead Trim and Form. Section 2 on page 3 specifically gives a min/max range for the thickness.

Additionally, this application note may be useful: A Nickel-Palladium-Gold Integrated Circuit Lead Finish and Its Potential for Solder-Joint Embrittlement

Thanks,

Sarah

0 Andy Fondaw 2 months ago

TI__Expert 5061 points

Hi Ruby,

The gold plating thickness on our ceramic device leads and thermal pads is between 50 µ-in and 225 µ-in in thickness.

Degolding is usually performed by solder dipping / pre-tinning the leads and thermal pad(s). While TI does not provide a procedure, many subcons / contract manufacturers have procedures in place for this.

The Application Report - Hermetic Package Reflow Profiles, Termination Finishes, and Lead Trim and Form, provides additional information and some general guidance, "A flowing solder-pot or two passes in a static solder-pot is recommended. Solder-pot solder composition should be periodically monitored for gold content"

Thanks,

Andy

0 RUBY ALUSH 2 months ago in reply to Sarah Koch

Prodigy 75 points

Thank you dear Sara

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TPS50601-SP: 5962R1022101VSC