Tool/software:
I am using the LMQ66430 in many new application and I like it a lot.
I have a question about separating the low-side MOFET current from the heat dissipation paths. Referencing the Data Sheet and SNVA721A.
The Data Sheet implies pin 6 is where this low-side MOSFET current flows, and the DAP, while GND, is for heat dissipation, not a current path. Yet the Data Sheet layout example shows a connection from DAP to pin 6, as well as NC pin 9, possible just to provide a return path for the RFBB, VCC decoupling and RT.
I am concerned about some of the low-side MOSFET current going through the DAP VIA to the GND plane and finding another less desirable return path.
Can I have the DAP ONLY connect to the GND plane for heat dissipation, use pin 6 for current path control, and provide another return path for RFBB, VCC and RT?