Hi,
I would like to ask a question on TPS6507x land pattern.
TPS6507x has only RSL package. There is a thermal pad underneath the IC’s die, which usually would be geometrically centered and symmetric. However, all examples I referenced show a displacement of the thermal pad and vias towards pin 1 position. (EVMAM1808 link).
Could anyone tell me why it is like this?
Zheng
