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TPS43060: TPS43060 EMI

Part Number: TPS43060

Tool/software:

   

Hello, I would like to ask if there is an EMI test report for the TPS43060EVM-199 demo board? Because I saw in the document SLVU828A that this demo board does not follow the general universal layou method of DC-DC, that is, the top layer is the power layer, the second layer is the mapping layer (i.e. the eddy current layer), the third layer is the signal layer, and the fourth layer is the reference ground. And please help explain the reason.

  

  • Hi Sammy,

    Thanks for using the e2e forum.
    Unfortunately, there is no EMI test report available for the TPS43060 EVM board.
    The layout was created based on best practice knowledge of our engineers.

    Is the "universal layout method of DC-DC" you described a layout guide document, or also regarded as common knowledge?

    In layouting, there is not always an ideal solution for the perfect design, so trade-offs have to been made which may result in different layout solutions.
    Unfortunately, I cannot reach out to the original creator of this specific layout, so I cannot give an explanation for all layout decisions in this design, but if you have any concerns or questions on specific parts of the layout, please let me know.

    Best regards,
    Niklas

  • Hi Niklas,

       Thanks!

    I agree with your point of view(Compatibility with EMI and heat dissipation).

    Could you provide the PCB files for the TPS43060EVM-199 demo board?

    Such as Gerber files or .PCB files, so that I can refer to the LAYOUT more clearly.

    Best regards,

    Sammy

  • Hi Sammy,

    Thanks for your feedback.
    Unfortunately, we do not have the .PCB files available for TPS43060EVM board.
    All layout documents available are within the layout section of the User's Guide of the boards.
    I am sorry for this inconvenience.

    Alternatively, we do have a TINA design using TPS43060. Here more layout files are available. Hopefully this is helpful.
    https://www.ti.com/tool/TIDA-01558


    Best regards,
    Niklas