TPS745-Q1: Ecxml / Pdml/ Tzr version Simulation model application.

Tool/software:

Hi Team，

Harman uses the following chips in the platform, please help provide components detailed model：

Here is the requirement for detailed model:

Ecxml / Pdml/ Tzr version are all okay. Detailed model should conclude the density, capacity, and thermal conductivity for each internal components like Overmold, die, die attach, etc.