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BQ34Z100-G1: How to Holistically Optimize High-Freq EMI & Thermal Issues in NexFET Push-Pull DC-DC?

VBsemi MOSFET
Prodigy 150 points
Part Number: BQ34Z100-G1
Other Parts Discussed in Thread: UCC27714, UCC28C43, CSD19502Q5B

Tool/software:


Built a 100W isolated DC-DC using BQ34Z100-G1 + UCC28C43 + UCC27714 + NexFET (CSD19502Q5B):

  • High-freq EMI超标 – Tried RCD snubbers but losses increased.

  • MOSFETs run hot even with forced air cooling → Long-term reliability concerns.

Questions:
White check mark Any holistic solutions to optimize EMI and thermal performance in push-pull topologies?
White check mark Critical PCB layout considerations for high-frequency NexFET switching?
Many thanks!

  • 0
    TI__Mastermind 41770 points

    Hi  VB, a tight layout especially for the power stage can always improve  high frequency EMI. But i recommend modifying your input filter to reduce the problem frequencies. a  common mode choke and a ferrite bead stage that has the higher impedance at those target frequencies will help.