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BQ25960H: 器件失效

Bingbing Fang
Prodigy 10 points
Part Number: BQ25960H

Tool/software:

  • 0
    TI__Expert 8225 points

    Hello,

    Thank you for reaching out.

    Could you please translate your post to English so I can be sure I'm understanding correctly?

    Best regards,

    Alec

  • 0
    Prodigy 30 points

    HI IT:

    During our experiment, an abnormality occurred: the OTG could not be recognized. After analysis and localization, we found that this issue is related to your company's chip. We need your assistance in further analysis. Could you please provide an address so that we can send the defective chip back to your company for inspection?
  • 0 in reply to jianping feng
    TI__Expert 8225 points

    Hello Jianping,

    Could you please reach out to your assigned field quality engineer (FQE) and field applications engineer (FAE) to assist with the return process? I will reach out to them as well.

    Before you send the units, I'd like to do a quick check to better understand the issue. Could you please help answer the following questions:

    • What issue are you seeing with the BQ25960H?
    • What was the experiment that was performed?
    • What is the failure rate or how many units are affected?
    • Do you have any register logs from when the issue happened?
    • Is the device still communicating over I2C?
    • Can charge be enabled?

    Best regards,

    Alec

  • 0 in reply to Alec Lehman
    Prodigy 30 points

    HI TI，

    The problems we have encountered are as follows:

    1. The experiment we conducted was a small-angle drop test. After the drop test, we checked the functions and found that the OTG function was abnormal, but the charging function was normal.
    2. We arranged a total of 10 machines for the experiment, and only one machine malfunctioned.
    3. After the failure, we found that the machine had a shutdown leakage current of 100mA. Therefore, instead of capturing logs and register values, we chose to use thermal imaging to troubleshoot the fault. It was found that the BQ25960H was overheating. We then conducted cross-verification and confirmed that the fault was associated with the BQ25960H.

    We have already contacted the corresponding FAE. Could you please help coordinate and push forward the further analysis?

    Thank you!

  • 0 in reply to jianping feng
    Prodigy 30 points

    HI TI，

    Please provide the mailing address as soon as possible, as we need to get the analysis results quickly.

    Thank you.
  • 0 in reply to jianping feng
    TI__Expert 8225 points

    Hi Jianping,

    I understand this is very urgent. To make sure the return is smooth and without delays, the FAE needs to start the process. The FAE and FQE will first check the failed unit before sending it to us. This step is important to make sure everything goes through correctly.

    Have you been able to contact your FAE? Please let me know. They will provide the mailing address and help coordinate the next steps.

    Best regards,

    Alec