TPS61378-Q1: Requirement for thermal model

Jerry Zhang

Prodigy 155 points

Part Number: TPS61378-Q1

Tool/software:

Hi TI team,

Could you please provide the thermal model of TPS61378-Q1 to help do thermal simulation.

Here is the requirement:

Ecxml / Pdml/ Tzr version are all okay. Detailed model should conclude the density, capacity, and thermal conductivity for each internal components like Overmold, die, die attach, etc.

I'm looking forward to your reply~

Best Regards,

Jerry Zhang

1 month ago

0 Fergus He 1 month ago

TI__Genius 16225 points

Hi Jerry,

I will send you the simulation model by email.

Could you tell me your email address and more about the customer and EE?

BR,

Fergus

0 Jerry Zhang 1 month ago in reply to Fergus He

Prodigy 155 points

Hello Fergus,

Please contact my email Jerry.Zhang@harman.com, thanks for your prompt support~

Best Regards,

Jerry Zhang

+1 Fergus He 1 month ago in reply to Jerry Zhang

TI__Genius 16225 points

Hi Jerry,

I have sent the email.

I'm not sure the model contains the internal information, and we can communicate by email.

Best Regards,

Fergus

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TPS61378-Q1: Requirement for thermal model