Tool/software:
Dear Team Texas,
I hope this message finds you well.
I am reaching out regarding some recent issues we have encountered with the following lots of the TPIC6B596DWR component: 3CAF8HT, 3CAF8GT, 42A1EST, and 37DX83T. These components were previously functioning normally but have now presented unexpected behavior.
Upon investigation, I identified two important updates communicated by our IT and engineering teams:
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PCN #20221013001.2 (October 2022): This Product Change Notification outlines a migration to the DMOS6 process with 300 mm wafers, a change in bond wire material from gold (Au) to copper (Cu), and modifications in the package construction—although no changes in form, fit, or function were officially declared.
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Updated datasheet (Rev B – SLIS095B, March 2025): This revision maintains key electrical specifications (such as rDS(on), voltages, currents, and temperature range) but introduces editorial updates and revised notes.
To better understand the potential root causes of the failures, I kindly request your support in clarifying the following points:
Regarding PCN #20221013001.2 (October 2022)
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Could you please confirm the changes mentioned, especially the use of 300 mm wafers (DMOS6 process), copper bond wires, and package modifications?
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Were there any documented variations in key electrical or thermal parameters (e.g., rDS(on), peak current, avalanche energy, or thermal distribution)?
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What validation tests were carried out following the changes (e.g., yield analysis, reliability testing, or production line requalification)?
Regarding the updated datasheet (Rev B – SLIS095B, March 2025)
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Could you outline the specific differences between Rev A and Rev B, particularly regarding tolerances, technical notes, or control signal timings such as SRCK, RCK, and SRCLR?
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Are there any changes that could subtly affect the component’s performance in our application?
Regarding the affected lots
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Do any of the mentioned codes (3CAF8HT, 3CAF8GT, 42A1EST, 37DX83T) appear in your internal records with known technical deviations or customer complaints?
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Would it be possible to send us samples from some of these or recent lots (e.g., 3CAF8HT or 37DX83T) for bench testing and comparison?
Quality history and practical recommendations
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Do you have any available Failure Analysis (FA) reports related to the affected lots?
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Are there any technical notes or recommendations related to soldering profile (reflow), inductive load usage, or decoupling practices specific to the Rev B version?
We truly appreciate your attention and collaboration. We are fully available to provide samples, technical data, or any further information that could support your analysis.
Thank you in advance for your support!
