Tool/software:
Hi TI,
I would like to ask for advice, if you have any tips how to improve my layout to be able take 2 to 3A from TPS563212. Because currently I think, that have some issue with thermal protection.
Design parameters:
- Vin = 11 to 17V
- Vout = 5.2V
- Iout = 2-3A
My board is very small - 12.9x8.1mm. Below is my current design (v2). I am able to take stable output current 1.7A. If I increased it to 2A, then the TPS563212 heat up more and after few seconds/minute it start throttling and Vout is not stable and drooping. I measure the temperature with laser FLUKE thermometer and the top package temperature was about 44-48 celsius. How to calculate the junction temperature?
This board is 4Layer with one GND plane and one Vout(5V) plane.
Since, this package don't have thermal pad and also my board is very small so the thermal performance are not probably the best.
Below I am sending improved new layout (v2.1) which I want to try. Also this board is 4Layer with two internal GND layers. I added more vias to GND near the TPS563212 and added there bigger GND polygon.
My question is, if you see in my layout something what can be improved to achieve better thermal performance? Is is better to connect bigger copper to GND (pin4) or to VCC(pin2)? Or to another pin?
Thanks for advice.
Best regards,
Martin
