Tool/software:
The power density is quite high on this part. Do you have any recommendations for cooling method? The power density is higher than what we would normally use forced air cooling for. Is my intuition off base? It seems like a thermal spreader or a cool plate may be required as opposed to a TIM directly to a heatsink. Do you guys sell a thermal spreader for this?
We are prototyping a board to do testing right now but I am trying to do some leg work beforehand.
