Tool/software:
I need to assess an older board design for compliance to tin whisker mitigations per GEIA-STD-0005-2 Control Level 2B. The board includes a power module DCH010515SN7. It is not immediately clear from the datasheet whether this device is itself mitigated for tin whiskers. The attachment to our board is acceptable, but I need to know about the component finishes, solder, etc. on the device itself. If it uses tin-lead solder and tin-lead finish (or non tin finish) components, then it is compliant. If it uses lead-free tin finish components and lead-free solder, I need to know if there is any encapsulation or potting material around all the device terminals to mitigate tin whisker growth. Can TI provide clarification on the construction of the device itself to assure it meets the tin whisker mitigation requirement?
