Tool/software:
Hi Team,
Do we have Rjb parameter for CSD18511Q5A? junction to board coefficient?
Thank you,
Yishan Chen
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Tool/software:
Hi Team,
Do we have Rjb parameter for CSD18511Q5A? junction to board coefficient?
Thank you,
Yishan Chen
Hello Yishan,
Thanks for the inquiry. The junction-to-case, Rθjc = 1.2°C/W max, thermal resistance specified in the datasheet is from junction to the thermal (drain) pad with the device mounted on a PCB as detailed in the datasheet. This is the primary path to remove heat from the device and into the PCB. Please see the blog at the link below for more details on how TI specs thermal resistance. Let me know if you have any additional questions.
https://www.ti.com/lit/ta/ssztb80/ssztb80.pdf
Best Regards,
John Wallace