• Lead finish: NiPdAu
• MSL rating/Peak reflow: Level-3-250C-168 HR
• Package body size: 6.5 x 7.5 x 4 mm
• Solderability: Pass (per J-STD-002 with >95% lead coverage)
• Temperature cycle testing: Pass (-65/150°C, 500 cycles)
• Reliability testing: Passed all JEDEC standard tests

Based on these specifications, the TPSM843B22RDGR-ET part is compatible with standard leaded soldering processes.

J-STD-002 standard includes test methods for both tin-lead (SnPb) and lead-free solders

Material Attributes Search
Source: https://www.ti.com/quality-reliability-packaging-download/report?opn=TPSM843B22RDGR-ET