Tool/software:
Could you please answer my questions as follows?
#1 Is “Thermal swing” NOT equal to “Auto-Retry”?
#2 After an overcurrent occurs, but Tj does not rise, does the protection work as hiccup behavior (Auto-Retry)?"
#3 From what temperature does Thermal swing restart?
#4 Is this understanding of the period correct?
The design is based on this.
Thank you for your support.
#5 Please let me know the condition under which ICL(STD) disappears.
The measurement result is shown in the two captures:
・VS=14V
・DELAY=5V （Auto-retry）
・DIAG_EN=0V
・OUT=Short to GND (never cleared)
・IN=3.3V
There are the period that is not appear the ICL(STD) in the waveform.
I understood the temperature of this IC is fall, then the “Thermal swing” re-start due to the large current based on the Short-to-GND.
However, I don’t catch the reason why ICL(STD) disappears even the output current keeps as Short-to-GND.
Hey,
Thermal swing is a component of the thermal shutdown protection. The thermal swing shutdown threshold in the datasheet is 60C this is identified as the fast temperature increase when the DUT experiences a short to ground (as outlined in the image).
The device will then retry as the it cools to the hysteresis level which is 10C and continue this process until the TJ reaches T(SD) which is 175C. Once this happens the device output current is limited to ICL(TSD) until it is cooled to the thermal shutdown status reset parameter, which is 155C.
BR,
Alan
