Tool/software:
Hi, Team.
We are using LM1086CSX-3.3/NOPB. During the production process, we are experiencing an issue with lead discoloration, resembling oxidation, after the reflow process.
The reflow peak temperature is set to 245°C.
After testing with three lots, discoloration occurred in all of them.
Can we conclude that the discoloration is solely due to tin plating? We are concerned about the potential reliability issues caused by the discoloration and need to take countermeasures. We have confirmed that there are no issues with the functional testing. Please let us know if the discoloration could affect the reliability of the chip. If there are no issues with reliability (or functionality), we will continue to use it as is.
Reflow Condition
1. Peak temp : 245
2. The reflow soldering is being managed at a quality level of 2000~3000 ppm.
3. Profile Data

