Tool/software:
Dear TI Product Engineers and Assembly Engineers,
The LM63635DQPWPRQ1 has an exposed pad on the back of the product to improve heat dissipation.
The customer is concerned about the effect the solder joint area has on electrical performance.
Please submit verification data providing answers to the following questions:
Q1. What percentage or more of the solder joint area of the exposed pad is recommended?
Q2. Please confirm whether there are any problems with electrical performance when the exposed pad solder joint area is 50%.
Q3. Please confirm whether there are any problems with electrical performance when the exposed pad solder joint area is 0%.
Q4. Regarding Q2 and Q3, Please submit data verifying the rate of change in electrical characteristics and experimental data.
Junji,
