Tool/software:
Hi.,
In our new design, We are using TPS546D24ARVFR (QFN Package). Based on thermal Simulation, this device requires a Heatsink to keep the device below 100degree of Junction. Hence we would like to know what is the Max long term compressive force/pressure allowed over this device. This data will help us to plan a suitable Heatsink attachment method.
Regards
Boopathi