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TPS546D24A: Max long term compressive force allowed over device

Boopathi Muthusamy
Prodigy 40 points
Part Number: TPS546D24A

Tool/software:

Hi.,

     In our new design, We are using TPS546D24ARVFR (QFN Package). Based on thermal Simulation, this device requires a Heatsink to keep the  device below 100degree of Junction. Hence we would like to know what is the Max long term compressive force/pressure allowed over this device. This data will help us to plan a suitable Heatsink attachment method.

Regards

Boopathi

  • 0
    TI__Genius 11396 points

    Hi Boopathi,

    TI recommends a force of up to 10 Newtons uniformly spread across the top of the package and perpendicular to the mounting surface. 

    Uneven distribution of force, or shearing force no perpendicular to the mounting surface of the package can alter the internal mechanical stresses on the silicon die and affect the electrical parameters or cause damage to the mechanical or electrical connections of the device.

    Thank you,
    Tomoya