TPS2662: Solder Coverage Rate of Exposed Pad

Kazuki Itoh

Part Number: TPS2662

Tool/software:

Hi team,

Were the solder coverage rates of the exposed pad monitored by X-ray when measuring the Rθja of 44.8°C/W for the TPS2662?

Do you know the solder coverage rate of the EXP-PAD at the time of measurement?

Best regards,

Kazuki Itoh

0 Amrit Jit 2 months ago

Hi Kazuki,

I will check for this info and get back.

0 Amrit Jit 2 months ago in reply to Amrit Jit

Hello Kazuki,

It's recommended 50 to 70% as per below app note section 4.4 Exposed-Pad Stencil Design.

25% has been determined to be a point of diminishing thermal performance returns, but TI prefers a limit of 50% to be set (reference JESD51-7).

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