CSD17313Q2: Is thermal treatment necessary?

Shinichi Inoue

Guru 21901 points

Part Number: CSD17313Q2
Other Parts Discussed in Thread: TIDA-00890, PMP9491

Tool/software:

Dear Specialists,

My customer is considering CSD17313Q2 and has a question.

I would be grateful if you could advise.

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Regarding CSD17313Q2 datasheet,

Recommended PCB layout is described datasheet P. 9,

However, there are no layout restrictions.

Are there any particular layout restrictions, thickness and thermal via ?

Especially is it needed thermal via for the 8-pin pad?

In our case, the application is USB3.0 Vbus(5V900mA)

Could you provide PCB layout example?

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I appreciate your great help in advance/

Best regards,

Shinichi

2 months ago

+1 John Wallace1 2 months ago

TI__Mastermind 39300 points

Hello Shinichi,

Thanks for your interest in TI FETs. For the 2x2mm SON package, the customer should maximize the copper shape connecting to the drain pads. This is the main path to remove heat from the package. The size of the drain pad limits the number of thermal vias to probably 1 or 2 vias. The copper shape can be extended beyond package outline to accommodate additional thermal vias. There are many reference designs on TI.com that use this part including TIDA-00890 and PMP9491. You can download and view the gerber files using a free file viewer. Online Gerber Viewer at the link below allows you to load the zip file with the gerbers. Please review and let me know if you have any questions.

https://www.gerber-viewer.com/

Best Regards,

John Wallace

TI FET Applications

+1 John Wallace1 2 months ago in reply to John Wallace1

TI__Mastermind 39300 points

Hi Shinichi,

The link below is to a useful app note on QFN and SON PCB attachment.

https://www.ti.com/lit/pdf/slua271

Thanks,

John

0 Shinichi Inoue 2 months ago in reply to John Wallace1

Guru 21901 points

Hi John,

Thank you for your reply.

I shared your suggestion with the customer.

I appreciate your great help and cooperation.

Best regards,

Shinichi

Power management

Power management forum

CSD17313Q2: Is thermal treatment necessary?