LM2679: Inquiry regarding the solder wetting area of LM2679SX-5.0/NOPB

Part Number: LM2679

Tool/software:

Hi IT team,

During our production today, we found that this area could not be wetted with solder, as shown in the bottom-left figure.

However, some parts could indeed be soldered in that same location, as shown in the bottom-right figure.

    

Therefore, we checked the parts in our inventory. Some parts have silver-colored pads at this end, while some others appear black and have no pads(The part in the middle of the following left figure).

What we'd like to confirm with you is, what are the areas on this part that need to be soldered and which locations don't? It appears that some spots are unable to be wetted with solder.

  

In addition, we also observed what appears to be exposed copper on the sides of this component. Is this normal? These areas do not need to be soldered, is that correct?

  • Hello

    I will speak with our package engineers and get back to you as soon as possible.

    Thanks

  • Hello

    Here is the response from our packaging engineer:

    Per the IPC-J-STD-001 (Rev J Year 2024) there is an allowance for the wettable area on the “trimmed” edges which is also known as a chamfer edge to be excluded if it doesn’t wet with solder.  This is reference to the Thermal Pad End Joint and Note 2 in the table below.

     

    Based on this the joint IPC/Jedec solderability standard below has an allowance to ignore those areas if not present with solder.  Note the file is write protected so I had to take a photo to share the page with you.  This standard is the latest revision published.