Tool/software:
Hi team
Customer is thinking to increase the # of vias as below. In general, what can be expeted in terms of electrical characterics if # of vias is increased?
Regards,
Noriyuki Takahashi
Tool/software:
Hi team
Customer is thinking to increase the # of vias as below. In general, what can be expeted in terms of electrical characterics if # of vias is increased?
Regards,
Noriyuki Takahashi
Hi Noriyuki,
I am attaching a beautiful app note regarding the use of via, how it will help for heat dissipation.
Please go through this app note.
Regards,
Manish
Hi Manish,
Based on the description of the app note below, vias should be placed with 1mm spacing. Do this mean that in general TI doesn't recommend to palce vias as the picture below? This is because the space between vias is too small in this example.
Regards,
Noriyuki Takahashi
Hi Noriyuki,
Basically, this is the good practice of placing the vias, if you are using this kind of methodology, you will get better heat dissipation.
Regards,
Manish