TPS631000: material used for the bonding wire

Chie Nakamura

Part Number: TPS631000

Tool/software:

Could you please let me know whether the bonding wire in the TPS631000 is made of copper or gold?

0 Brigitte 3 days ago

Hello Chie,

Let me check if this is information I can share.

Best regards,
Brigitte

0 Brigitte 2 days ago in reply to Brigitte

Hello Chie,

This device is not having bond wires. For the material information, have a look here: Quality, reliability, and packaging data download | TI.com

Best regards,
Brigitte

0 Chie Nakamura 1 day ago in reply to Brigitte

Is this device based on a flip-chip architecture?

0 Brigitte 1 day ago in reply to Chie Nakamura

Hello Chie,

Yes.

Best regards,
Brigitte

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