CSD87313DMS: CSD87313DMS junction-to-board thermal resistance

Hello Hailiang,

Thanks for the inquiry. I pulled up the characterization data collected during product development. The max thermal resistance, Rθjc = 5.6°C/W measured to the thermal pads (S1, S2) on the bottom of the package mounted on a 1in², 2 oz. copper pad. Please let me know if you need any additional information.

Best Regards,

John Wallace

TI FET Applications

Hi Hailiang,

TI does not spec junction-to-board thermal resistance. However, the junction-to-case (thermal pad) thermal resistance is measured and specified with the device mounted on a PCB as described above and should be essentially the same as the pads are soldered directly to the PCB copper. Please see the blog at the link below for more information on how TI tests and specifies thermal resistance.

https://www.ti.com/lit/ta/ssztb80/ssztb80.pdf

Thanks,

John