Tool/software:
Hello,
I am curious about the length of the exposed thermal pad under the TLV755P module, in the SOT-23 DYD package. This dimensions is missing from the datasheet (see attached image). I need this dimensions to be able to make the layout for this component.
Hi Tolga,
Thank you for asking us!
I believe the thermal pad is sized to be the same height as the package body here, so 1.7mm (average of 1.65mm-1.75mm)
Went ahead and double checked by overlaying them, this should confirm it
It also lines up on our publicly available footprint here for the part & package combo here: Ultra Librarian for TI
Best,
Gregory Thompson
