The first failure phenomenon: Damage during the DO output process.
The first phenomenon is that after the module has been running stably for half an hour, the fourth output channel of the chip is enabled to output a high level externally and connected to the relay terminal. After the channel output, the chip burns out. The module wiring is normal. After replacing the new module, the above situation did not occur.
The second failure situation: The chip is powered on 24V, but the channel is not enabled. A 24V DI signal is applied to the channel. The input DI signal and the chip power supply are powered on simultaneously. At the moment of power-on, the chip is damaged. Replace the new module and retest it according to the same operation. No chip damage was found
