TMS570LC4357-EP: Reflow Profile

Hello Latha,

Thank you for reaching out about the reflow profile for the TMS570LC4357-EP in your DANA LD 800 Inverter project.

Based on my search, TI does not publish a detailed reflow profile specification for this device in the standard datasheet or application notes. However, I do have some useful information:

What we know about the device:

• The TMS570LC4357-EP uses an NFBGA package with lead (SnPb) solder balls
• The maximum reflow temperature specification is 220°C 1
• The MSL (Moisture Sensitivity Level) rating is Level-3-220C-168 HR

Next steps I'd suggest:

1. Check your PCB assembly vendor's standard lead-solder reflow profile — they typically follow industry-standard profiles (IPC-A-610) for SnPb assemblies with a 220°C peak temperature limit.

2. Verify your assembly process against the MSL-3 moisture sensitivity requirements to ensure proper bake-out and handling before reflow.

Is there a specific aspect of the reflow process (peak temperature, ramp rate, or soak duration) that's critical for your application? That might help me point you toward the right resource.

Resources:

1. TMS570LC4357-EP Reflow Temperature Discussion

Best Regards,

Zackary Fleenor

Thank you for the quick response.. Ours is Lead free profile

Hi Latha,

Please refer below similar issue that we answered:

(+) TMS570LC4357-EP: Reflow temp - Arm-based microcontrollers - INTERNAL forum - Arm-based microcontrollers - INTERNAL - TI E2E support forums

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Thanks & regards,
Jagadish.