[TPS22902] Landing Pattern

Benjamin Mak

Other Parts Discussed in Thread: TPS22902

Hi Team!

I am looking at the TPS22902 and want to find the landing pattern for this. I looked at the datasheet and could only find the mechanical drawing. However, I do not see one available. Am I missing something? Is there one readily available?

Thanks!

Ben

over 12 years ago

0 Smriti B over 12 years ago

TI__Expert 5565 points

Ben,

I have attached an app note that outlines land pattern definition for WCSP in general. Since WCSP land pattern depends on pitch and bump size, it is irrelevant on the size of the package.

The TPS22902 has a bump size of 225um. On slide 4, you will notice various bump sizes and their associated PCB dimensions. Use the 250um bump size for the TPS22902 land pattern.

0243.WCSP_PCB_Design_Application_Note.pdf