Team,
Can you confirm if the solder ball composition on the uSIP packages are SnAgCu? It doesn't show on the product content section of the product folder or datasheet.
Regards,
Aaron
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Team,
Can you confirm if the solder ball composition on the uSIP packages are SnAgCu? It doesn't show on the product content section of the product folder or datasheet.
Regards,
Aaron
I believe this app note contains the required information: http://www.ti.com/lit/ug/slib006/slib006.pdf