Hello! I'm trying to research the bake time for TI part number LM2940S-5.0 for dry pack packaging per J-STD-033. According to TI's data sheet on this part number, the MSL = 3. However, the mechanical data sheet shows this part's thickness (in relation to measuring device thickness using J-STD-033) can be greater than 4.5 mm. Using J-STD-033, this part could meet either criteria in J-STD-033 Table. 4-2, with device thickness being MSL=3, <or= 4.5 mm thickness or MSL=3, >4.5mm. The bake time is not straight-forward for devices with a thickness greater than 4.5mm. Therefore, since the tolerancing for this part can be greater than 4.5mm, how many hours should one use to properly bake and dry pack greater than 4.5mm thickness devices?
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