Materials Declaration PTH12050LAZT, PTH12020LAZT, PTH08T260WAZT, PTH08080WAZT

Federico Ruiz

Can you please provide the materials declaration sheet for the parts PTH12050LAZT, PTH12020LAZT, PTH08T260WAZT, PTH08080WAZT. We are placing those parts on the same PCBA currently manufactured by Sanmina.

Per avalaible datasheets all previously listed parts have solder balls that uses the same composition (SnAgCu) and Tin over nickel finish. I would like to know if there are any composition differences between those parts because with the part PTH12020LAZT, which is the larger power module of the listed parts we are experiencing some solder joint fall out.

Regards,

Federico Ruiz

federico.ruiz@sanmina.com Tel: (52) (33) 3284-2000 Ext 2328

over 12 years ago

0 Tom Guerin over 12 years ago

TI__Mastermind 38230 points

Materials Declaration PTH12050LAZT, PTH12020LAZT, PTH08T260WAZT, PTH08080WAZT have always used the same tin/silver copper solder ball fro all lead free units,WAZ,LAZ ,HAZ.(SAC)

I discussed this question and the reflow process with your cusotmer Bill Harker at Datadirect Networks.

Tom
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0 Federico Ruiz over 12 years ago in reply to Tom Guerin

Prodigy 20 points

Hi Tom,

Do you know which is the Pull test force limit for this kind of components considering a Good Solder Joint between the VR and PCB pad?

Thanks!

0 Tom Guerin over 12 years ago in reply to Federico Ruiz

TI__Mastermind 38230 points

Federico :

The "WAZ" or any lead Free pin version requires minimum reflow temperatures on the pins/ components to be minimum 240°C with a maximum 260°C. The solder paste requirement on the mother board assembly must be lead(Pb) Free solder paste( (SAC).

See application note SLTA054 fro addtional details

Tom

Power management

Power management forum

Materials Declaration PTH12050LAZT, PTH12020LAZT, PTH08T260WAZT, PTH08080WAZT