My application is for down hole drilling with environmental temperature up to 150C. It s a harsh environment with vibration averaging 6G and higher and shock of 60G and higher. I would like to implement the TPS62000-HT ceramic version (210C).
My question is that I would like to know of any potting or encapsulating compound that would work the best for ceramic ICs in high vibrations environment. Also, any other suggestion for reducing the chance of failures in a high shock and vibrations environment will be welcomed.
Benjamin Couture