Hi,
Does anyone have experience enough with Conducted and radiated EMI to answer this question for me? Recently a product I designed with the swift family converter failed emissions. The board has 4-layers with a ground plane under the inductor and another ground plane under the entire power supply on the second layer with lots of stitching vias. Is it better to leave an absence of copper through the board directly below the inductor and the active driving trace from the fet, or is it better to keep it shielded? Much of my conducted noise seemed to come from what appears to be inductive coupling into the plane from the inductor over it?
Any help would be appreciated.
Phil