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TLC59284 Detailed Thermal Information

R11
Expert 1485 points
Other Parts Discussed in Thread: TLC59284, TLC5927

When using the TLC59284 in the ‘DBQ’ (24-SSOP) package there is some thermal information in the datasheet but it isn’t clear the conditions surrounding that data.  Do you have any additional data for this package, especially when used in a 2s2p board?

  • 0
    Prodigy 5 points

    Comparing the TLC5967 DBQ package and the TLC59248 DBQ, it appears the TLC59248 THja was derived with a 1 sided board.

    TLC5927: 99.8 C/W single layer JEDEC standard.


    TLC59248: 91.5 C/W is very close to the 99.8 above.
    Using the same scaling factor for 4 layer 2S2P you get ~56C/W for the TLC59248 in a 2S2P board.

    Here are the general specifications for the JEDEC thermal resistance standards, called JESD documents.


     

  • 0 in reply to Ed Walker
    Expert 1485 points

    Great.  Thanks Ed!