TI Strain Limits for manufacturing assembly process - ICT?

Sean Moss

Seeking strain guidance /counter-force limits for TPS74201RGW (VQFN), or any generic TI Strain guidance to validate manufacturing fixtures/process will not cause physical damage to the components. If anyone can point me in the right direction for TI's maximum stain limit (microstrain) and maximum counter-force (lbf), it would be greatly appreciated.

over 12 years ago

0 Ryan Eslinger over 12 years ago

TI__Guru 55940 points

Hi Sean,

The maximum compressive load is 216N.

Very Respectfully,

Ryan

0 Sean Moss over 12 years ago in reply to Ryan Eslinger

Prodigy 45 points

Ryan,

Thank you for answering. What about diagonal strain limits (as defined in IPC/JEDEC-9704A); the amount of stress generated by PCB flexing/bowing during manufacturing assembly?

Semper Fi,

Sean

0 Ryan Eslinger over 12 years ago in reply to Sean Moss

TI__Guru 55940 points

Hi Sean,

I apologize for the delay, I am still trying to track down the requested information.

Very Respectfully,

Ryan

0 Ryan Eslinger over 11 years ago in reply to Ryan Eslinger

TI__Guru 55940 points

Hi Sean,

Again I apologize for the delay. Here is the information that I was able to find:

On board center the max strain is approx 2500 ue under a 1500G 0.5 ms drop impact. At package corner of the center package the max strain is approx 2800 ue. The board measured is a standard Jedec drop test board, i.e., 1.0 mm thick and 8 layers FR4 board. Solder alloy is SAC396.

Please note that the strain limits will depend on the board you choose, but this information can be used as a guideline.

Very Respectfully,

Ryan

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TI Strain Limits for manufacturing assembly process - ICT?