We are using this little regulator and like its performance very much. We have a new application which will use it and I have a couple of questions regarding Tj and heat sinking. Because of size constraints for this project, the circuit board size is limited to 0.310" x 0.313" (.031 thick FR4). This little regulator fits very nicely within our size limitations.
Two questions:
Tj (max) for this device is 125 deg C. We plan to operate it at 100 deg C maximum and are interested if continued use at this device temp with have any limiting effects on its life. The data sheet implies that continuous operation at 125 deg C is the devices limit, which beyond that would cause thermal shutdown. So... we're assuming that 100 deg lead frame temp would be OK (?)
Second, knowing that SOT packages are inherently poor at heat dissipation, we want to assist as muck as we can withing the space we have in providing copper plane heat sinking for the device. Since usually, the ground pins for most SMD devices are where most of the thermals are, is that true with this device also, or would splitting copper plane heat sinking between ground and the output pins be of any help. We realize that the tiny SOT pins are not good heat conductors due to their size, but we have no room for a device heat sink so we want to give it every bit of help we can.
Thank you for your assistance, you are always very helpful.
Best regards, Tim
