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UCC27324 MSOP Power Pad connection.

Alfredo Rubio
Prodigy 90 points

We are using this device with in a design based on the HVPSFB and it get a little bit hot.

Right now we are using the Package and we would like to evaluate the MSOP powerpad package looking for a better thermal performance.

My question is if we can connect the Pin 3(GND) to the thermal pad, and integrate the thermal pad into the current GND plane. From the data sheet, I understand that the power pad is internally attached to GND pin (This is not very clear on the datasheet).


Thanks you in advance.

  • 0
    TI__Expert 4015 points

    Hi Alfredo, yes you can connect the PowerPad to the ground plane. Page 13 of the datasheet shown below explains that the pad is connected to the substrate which is the ground of the IC and recommends soldering the pad directly to the copper ground plane.

    You may find the references sited in page 13 helpful as well.

    Best Regards