I have researched the efforts of various parties regarding the BQ2000 series. One effort was noted in a graduate thesis in which the bq2000 was to be implemented in sensor generated power. This approach was a first and was considered to be novel concept. The author developed a crude breadboard prototype which achieved proof of concept and application. The author then designed and created the Printed Circuit Board using the schematic for the working breadboard. The author could not manage to get the PCB prototype to function despite the mirroring of the breadboard prototype. In the end the author had only been capable of producing a working design using crude material.
There is also an attempt by researchers designing a rechargeable hearing aid to use the bq2000. As soon as the device was built on PCB the bq2000 did not function. In the end the bq2000 was disregarded and resulted in a device which required removal of the battery. The battery would be charged with a standalone basic charger. This defeated the goal of having the hearing aid simply plug into micro-usb to charge.
I have made efforts to bring the BQ2000 series onto PCB and in one instance popped the IC. I would think TI has the information on the design and function of the bq2000 to create a simulation capable model to ease the difficulty found in final concept stage. My question is this; How can an engineer fully simulate their bq2000 based design to prevent the problems others have encountered?
I know that TI does not provide a spice model, TINA model, electronics workbench suite file, or any other potential simulated design files.