Our assembler has had yield problems with MSOP8 PowerPAD package and reworking the parts has been difficult. Our customer has asked us to re-design to eliminate the use of this package. However, in this particular application we are only dissipating < 50 mW of power and the package is rated for about 1W. I have assumed the rated specifications assume the PowerPad is soldered down. Can the TPS7A4901 be used for a 50 mW application with the PowerPad not soldered down? If so is are there any specifications or test data to support this type of application or would the customer have to perform their own testing?