I have a question about the preferred way to tie AGND and PGND on a board with 2 switching regulators (TI p/n TLV62130) and a LiPo charger IC (TI p/n BQ24170). All 3 ICs' datasheets say to tie AGND and PGND at their exposed thermal pads. I have a continuous analog/digital ground plane that spans the whole board, and in the power section of my board I have another plane for power ground. I would normally tie these two together at one point, to make sure much current isn't flowing through my analog/digital ground. It seems like tying them together in 3 places may cause problems. What is the suggested approach in this situation?
Thank you for your help!
Camron