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TPS74801 / Relation of thermal resistance and number of　via

Tsukui Yusuke
Guru 21930 points

Hi.

Please tell me about relationship between the number of vias and thermal resistance of TPS74801RGWR.
 
It is stated that  「RGW: The exposed pad is connected to the PCB ground layer through a 4x4 thermal via array.」 data sheet P3.
P27 in the data sheet is described as 「Example Board Layout  3x3 thermal via array」 on the other hand.
Please answer about what is described below.
 
1.Via conditions of thermal resistance measurement or different from Example Board Layout?
 
2.3x3 is correct, rather than the 4x4 is via the thermal resistance measurement?
 
3.Diameter of via the thermal resistance measurement is less than 0.3mm, can I get the same heat resistance  
   when I had it in via the conditions of Example Board Layout?
 
Best Regards,
Yusuke.