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Device = LP3965EMP
Pkg = SOT-223 / NDC / 5-pins
- - - - - - - -
Theta JA-High K = 65.4°C/W
Theta JC, top = 67.7°C/W
Theta JC, bottom = n/a
Theta JB = 10.1°C/W
Psi JT = 3.5°C/W
Psi JB = 9.9°C/W
I am unable to share the LP3965EMP Theta(J-L) information as it is not available at this time.
This will require an additional request for thermal analysis for a non-standard datasheet value be submitted to the packaging group.
I presume that, in this case, the 'Lead' of interest for the 5-pin SOT-223 would be Pin 5 (aka GND TAB).
I will get the new request submitted momentarily.
Just to confirm that the request has been submitted and I did request an expidited answer. However, there are a number of requests in the que ahead of me.
I do expect this may take a bit more than seven days.
This new request, with air flow rate and copper area, would only be appropriate for ThetaJA (junction-to-ambient), not for the requested ThetaJP (junction-to-pin).
ThetaJP (junction-to-pin) is similar to ThetaJC (junction-to-case) in that it is independent of externals such as PCB and air flow.
Please clarify which thermal parameter(s) you are seeking information for. I will either edit the existing request, or submit a new request. In some cases I may need additional information (i.e. board size, # of layers, copper weight per layer, copper area under the device tab, % copper coverage per layer, etc)
These resources may be helpful ...
WebTHERM Online Thermal Simulation (WEBENCH Design Center)
http://www.ti.com/lsds/ti/analog/webench/thermal-simulation.page
PCB Thermal Calculator (WEBENCH Design Center)
http://www.ti.com/adc/docs/midlevel.tsp?contentId=76735
For LP3965EMP SOT-223-5 Theta(junction-to-pin), where 'pin' is the GND Tab ...
Theta (Junction-to-Tab) = 9.6°C/W