BQ24618 Heats

With external FETs the IC does not dissipate as much power but it should be tied to ground to keeP the IC cool.

Is sounds like it is going into thermal shutdown and then comming out.

Try a can of freeze spray and see if it comes out quicker and stays out.  This should give you the answer.

Christophe Pinkers said:

Hi, I realized a design with the BQ 24618 coupled with a BQ 29312 and a BQ 2084-V143.

My design is completely functional but the BQ24618 Heats !!! I want to know if it's "normal" because My design is going to be produced something like 500+ pieces

This is my prototype and I have do a mistake. I haven't link the power pad to my ground plane... (I have one on a mid-layer but I remove it for link the different ground at a single point)

If I charge my batteries (2600mAH 4Cells) when I have charged about 25-30%, the charger Stop to charge, wait some times and charge again. (I can't put my finger on it, it's too hot)

My Question is : Is it Normal the BQ24618 is Heating?? I don't understand why he can heats, the current is in the Mosfets...

And if it is normal, is it sufficient put my powerpad to a ground plane (or two)?

Thx

I'm also struggled with same problem with BQ24600 IC last 10 days. For 3.3A charging current, Device, Mosfets & inductor temp rise goes in to morethan 75 degree Celsius. So far no improvement in my design. I already posted the issues in the name of " Stand-Alone battey Charger--> BQ24600" 

I'm also planning to use BQ24618 IC, have completed my PCB design. Probably i will get the PCB on tomorrow, I dont know what will happen?

I don't understand Y these devices are getting heated up? Internal structure of these ic is like this?

I have to charge 3.3A current, but i cannot put my finger on the device for few seconds when 1.5A current .

Kindly any one suggest some other part no for higher current with lower temp rise.

ThanX, Siba

the link below shows the layout for the EVM.  Any component that has a power pad probably puts out a fair amount of heat and needs to be connected to a copper plane.  The thicker the better.  I use 2oz.  The area of the copper plane should be at least 1 in sq for one watt of dissipation.  For quad packages, the only thermal path is from the power pad through multiple vias to another layer with a copper plane.

http://www.ti.com/general/docs/lit/getliterature.tsp?baseLiteratureNumber=tidu092&fileType=pdf