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TPS53355EVM vias effect

Ryuji
Guru 20090 points
Other Parts Discussed in Thread: TPS53355

Hello,

Please see the attached image.
TPS53355 has the many vias around the input/output capacitor and Vin/GND line.
Could you please le me know these vias effective ?

In my customer boards has large EMI noise.
Then they are confirming this for the possibility of reduce the EMI.

Best Regards,
Ryuji Asaka

  • 0
    TI__Guru**** 191445 points

    The EVM is 6 layers.  The vias tightly couple the top side ground area to the internal and bottom side ground copper areas.  Additionally, on the bottom layer are extra VOUT and VIN copper areas.  There are additional vias to connect the top and bottom VIN and VOUT areas.  Layout is a big factor for EMI.  Reducing the circulating current paths and minimizing the parasitic inductance can help a lot.

  • 0 in reply to JohnTucker
    Guru 20090 points

    Hello,

    Thank you for the reply.
    I understand that the reason as the following.

    -ensuring the high current paths
    -reducing the circulating current paths
    -minimizing the parastic inductance

    Best Regads,
    Ryuji Asaka