Hello-
We are concerned about PCB cleaning after assembly of the LMR24210, as there are exposed edges of the die. Are there any limitations or special requirements which should be observed?
Thanks and Best Regards,
-Tim Starr on behalf of MQ@MK
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Hello-
We are concerned about PCB cleaning after assembly of the LMR24210, as there are exposed edges of the die. Are there any limitations or special requirements which should be observed?
Thanks and Best Regards,
-Tim Starr on behalf of MQ@MK
Hello Tim,
Please refer to this link for a document covering this BGA package; section 8 talks about Solder paste reflow and cleaning. As long as you're following industry standards we have not encountered any issue. Let us know if you have additional questions.
http://www.ti.com/lit/an/snva009ae/snva009ae.pdf
Best Regards,
-JP