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LP5907 YKE004 DSBGA PCB Mounting

danny sopher
Prodigy 10 points


Donald sorry for changing the subject but we are planning to use

EPCAD requires some information to determine the correct pad size. Please provide the information listed below.

 This part comes in a .35mm BGA. package  (TI drawing YKE0004) We have no reliability information for this pitch part. We need to know if the pad on the part is Soldermask defined and if it is what is the opening size? If it is not soldermask defined what is the pad size, and ball diameter, as well as tolerance, for the ball attachment area.

MFGR.

PACKAGE DESIG-NATION

PIN PITCH

Ball Dia / Tol Øb(mm)

Solder Mask Defined Yes/No

Device Solder Mask Opening Ø(mm)

Recommended Vendor Data Land Ø(mm) for PWB

 TI

 YKE004

 .35

 

 

 

 

 

  • 0
    TI__Mastermind 22610 points

    I have split this thread off for two reasons: 1) Changing the subject material from the thread title is generally not helpful to the forum; 2) I typically do not re-visit a thread if it already has an accepted/verified answer.

    I have forwarded your question to the Packaging Group. They should have a detailed answer for you shortly.

  • 0 in reply to Donald Jones
    TI__Prodigy 240 points

    Whether to design the part as soldermask defined (SMD) or non-soldermask defined (NSMD) is at the criteria of the user.

    Normally we indicate NSMD as "preferred" because the solder joint grabs around the edges of the pad and thus could improve reliability. But if the PCB design requires an un-balanced amount of metal (i.e. traces or planes) connecting to the footprint, then an SMD approach will provide a consistent metal area over which solder can spread during assembly and prevent any tilting of the package.

    The suggested numbers are:
       NSMD = 0.18mm pads, 0.245mm max solder mask opening, or,
         SMD = 0.245mm min pads, 0.18mm mask openings
     Paste = 0.21mm square with rounded corners for both cases.

    These are illustrated on the attached drawing that is being reviewed for release.

    2045.YKE0004_4220102_datasheet_NR.pdf

    Any questions, please let us know.