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TLV1117-33 DCY Thermal management

Troy Petersen
Prodigy 10 points
Other Parts Discussed in Thread: TLV1117

Hello,

I was looking to see what kind of thermal management is suggested for the DCY package of the TLV1117. The regulator will be fed 5 volts, so the maximum power dissipation should be 1.36 W. (assuming (5-3.3)V*800mA)

On the data sheet the other packages have mention of connecting the pads to a spreading plane, but the DCY package has nothing mentioned. Additionally, the thermal calculator only has the option of the DRJ package. Would connecting the pad to a plane (of the same calculated size as the DRJ package) be sufficient? Or is this much management not needed?

Thanks,

Troy

  • 0
    TI__Guru**** 164456 points

    Troy,

    The DCY has lower thermal resistance to bottom (pad) than the DRJ thermal resistance.

    Therefore the DRJ size recommendation will also apply to the DCY package. I would not go smaller size because the size is based mostly on wattage to dissipate.