This thread has been locked.

If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.

TPS54620 thermal information

Other Parts Discussed in Thread: TPS54620

Please let me know about TPS54620 thermal information.

I looked at datasheet SLVS949D and SLVS949C (old datasheet). The thermal impedance and parameter value are difference between new datasheet and old one. For example, ψjt is 5 degC/W in old datasheet and it is 0.6 and 0.7 degC/W in new datasheet. I would like to know the reason why these value are changed.

Best Regards,

Kohei Sasaki

  • Hello, and thanks for the interest in TPS54620.

    The metrics from the previous datasheet were measured numbers from our EVM boards. The thermal metrics in the "D" version refer to JEDEC standard High-K board measurements. The new version contains the JEDEC numbers because those are the industry standard values. You may refer to www.ti.com/.../spra953b.pdf for more information about the metrics. Thermal metrics in general will be very dependent on the measurement setup, so its not surprising the results are different for two sets of conditions.

    Really the thermal metrics should be used during the design phase for estimation, and then measurements made during the prototype phase to ensure the devices are being operated within their safe operating area.

    One more thing you should be aware of is that the TPS54620RHL and TPS54620RGY are actually the same devices now (same leadframe and package as well as controller silicon). Refer to the column labeled RHY for these emtrics. (RHY should say RHL, this is a typo we need to fix).