TPS22924CYZPR Solder Ball Pad Size on the TPS22924CYZPR package

Bob Kriner

What is the Solder Ball Pad Size on the TPS22924CYZPR package? The datasheet calls out a dimension for what appears to be the solder ball (0.21-0.25mm), but we would like to know the pad size on the part itself.

over 10 years ago

0 Adam Hoover over 10 years ago

TI__Expert 5275 points

Hi,

The footprint for this device should have these measurements:

Pad and top paste 0.23mm in diameter
Solder Mask 0.31mm in diameter (0.4mm expansion value)

Best Regards
Adam Hoover
TI Applications Support

0 Bob Kriner over 10 years ago in reply to Adam Hoover

Prodigy 180 points

We have the TI-recommended pad size for WCSP packages. But we would like to know the Solder Ball Pad Size on the TPS22924CYZPR package.

0 Ernesto Rey over 10 years ago in reply to Bob Kriner

TI__Prodigy 240 points

Adam,

The UBM opening (ball attach pad) on the package is 0.21mm in diameter. The latest package data including land pattern and stencil recommendations is attached.

YZP0006 ePOD DS 4219524a.pdf

0 Bob Kriner over 10 years ago in reply to Ernesto Rey

Prodigy 180 points

Thanks Ernesto. That answered the question. I'm a new user here, and I think I've checked the right boxes to confirm we have an answer on this now. If there's anything more I need to do in order to close this out, please let me know.
Thanks again for your support.Bob KHarris Corp.

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TPS22924CYZPR Solder Ball Pad Size on the TPS22924CYZPR package