I have carried out a thermal survey and monitred the temperature on the case of the TL1963A-15DCQ in my design. How can i use this information to work out the junction temperature of the device.
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Refer to the section on : 'Psi-jt (Ψjt) Junction-to-Top of Package' in this app note:
Semiconductor and IC Package Thermal Metrics SPRA953
http://www.ti.com/lit/an/spra953b/spra953b.pdf?keyMatch=spra953b.pdf&tisearch=Search-EN-Everything